The DDR3 storage chip is designed and manufactured by Yizhuo specifically for the demanding application scenarios of industrial embedded systems and military-grade products, utilizing original wafers as its base. This product exhibits robust stability across a wide range of high and low temperatures. Consequently, it can be used as a direct replacement for comparable DDR3 storage chips offered by companies such as Micron and Samsung.
Product Features
Storage Interface: Standard SSTL Interface
Package Size: FBGA96
Capacity Range: 2Gb～8Gb
Bit Width: x8 / x16
Operating Frequency: 800MHz or 933MHz
Power Supply: 1.35V/1.5V
Working Temperature: -40℃～+85℃; Storage Temperature: -45℃～+90℃
Complies with GJB7400 N1 Standard Requirements
Physical Dimensions: 13mm x 9mm x 1.2mm；
Packaging:FBGA96；
Product Specifications
Typical Application
Compatible and pin-to-pin replacement for Micron's MT41J64M16GJT-15EAIT series.