The NVMe BGA SSD storage chip, independently developed by Yizhuo, utilizes 100% Chinese design and technology. This chip features a PCIe* Gen3 x4 interface, and compared to traditional M.2 SSDs, it boasts a smaller size, lighter weight, lower power consumption, excellent stability, and high reliability.
Product Features
Storage Interface: PCIe*Gen3 x4
Capacity Range: pSLC 128GB
Sequential Read Speed: Up to 1800MB/s; Sequential Write Speed: Up to 1000MB/s
Working Temperature: -40℃ to +85℃
Storage Temperature: -45℃ to +90℃
Power Supply: VCC (3.3V, 1.2V, 1.8V)
Compatible with most operating systems, including DOS, Windows XP, Windows 7, Windows 10, Windows 11, Linux, and UNIX, as well as Chinese system platforms such as Loongson, Feiteng, and Rockchip.
Environmental Testing and Reliability: Complies with relevant provisions of GJB150A
Physical Dimensions: 16.0mm x 20.0mm x 1.58mm
Packaging: FBGA291
Product Specifications
Typical Application
Applied in ruggedized tablets, replacing the PCIe BGA SSD corresponding to American SMI.