The NVMe BGA SSD storage chip, independently developed by Yizhuo, utilizes 100% Chinese design and technology. This chip features a PCIe* Gen3 x4 interface, and compared to traditional M.2 SSDs, it boasts a smaller size, lighter weight, lower power consumption, excellent stability, and high reliability.


Product Features

  • Storage Interface: PCIe*Gen3 x4

  • Capacity Range: pSLC 128GB

  • Sequential Read Speed: Up to 1800MB/s; Sequential Write Speed: Up to 1000MB/s

  • Working Temperature: -40℃ to +85℃

  • Storage Temperature: -45℃ to +90℃

  • Power Supply: VCC (3.3V, 1.2V, 1.8V)

  • Compatible with most operating systems, including DOS, Windows XP, Windows 7, Windows 10, Windows 11, Linux, and UNIX, as well as Chinese system platforms such as Loongson, Feiteng, and Rockchip.

  • Environmental Testing and Reliability: Complies with relevant provisions of GJB150A

  • Physical Dimensions: 16.0mm x 20.0mm x 1.58mm

  • Packaging: FBGA291

 

Product Specifications

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Typical Application

Applied in ruggedized tablets, replacing the PCIe BGA SSD corresponding to American SMI.